Customization: | Available |
---|---|
Metal Coating: | Copper |
Mode of Production: | SMT |
Still deciding? Get samples of US$ 5/Piece
Request Sample
|
Suppliers with verified business licenses
Audited by an independent third-party inspection agency
![]() |
![]() |
![]() |
![]() |
Production Ability For PCB | |
Layer: | 1-64 layer |
Surface: | HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. |
Copper thickness: | 0.25 Oz -12 Oz |
Material: | FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers |
Board thickness | 0.1 to 6.0mm(4 to 240mil) |
Minimum line width/space | 0.076/0.076mm |
Minimum line gap | +/-10% |
Outer layer copper thickness | 140um(bulk) 210um(pcb prototype) |
Inner layer copper thickness | 70um(bulk) 150um(pcb protytype) |
Min.finished hole size(Mechanical) | 0.15mm |
Min.finished hole size (laser hole) | 0.1mm |
Aspect ratio | 10:01(bulk) 13:01(pcb prototype) |
Solder Mask Color | Green,Blue,Black,White,Yellow,Red,Grey |
Tolerance of dimension size | +/-0.1mm |
Tolerance of board thickness | <1.0mm +/-0.1mm |
Tolerance of finished NPTH hole size | +/-0.05mm |
Tolerance of finished PTH hole size | +/-0.076mm |
Delivery time | Mass:10~12d/ Sample:5~7D |
Capacity | 35000sq/m |
Production Ability For PCB Assembly | |
Stencil Size: | 640x640mm |
Minimum IC Pitch: | 0.2mm |
Minimum chip size: | 0201 (0.2x0.1) |
Min. space of BGA: | 0.3mm |
Max.precision of IC assembly: | ±0.03mm |
SMT capacity: | ≥2 million points/day |
DIP capacity: | ≥100k parts/day |
electronic product final assembly: | electronic product final assembly: |
Certification: | ISO9001:2015, ISO13485:2016, IAFT16949:2016 |